Description
Principle
Realize three-dimensional measurement on solder paste used in accurate printing through phase modulation profilometry. Ensure high speed measurement. Meanwhile, dramatically improve measuring accuracy.
Reduce height error
The dynamic self-adaptive datum plane algorithm is used to level the datum plane to solve the height difference problem caused by the bending of the jig or the board, and improve the accuracy of the pad positioning.
AI algorithm, intelligent programming
Without gerber file, one-click search can be realized to intelligently identify the solder paste area, without manual color extraction, simple and efficient, easy to use
Intelligent solder paste detection algorithm:
One algorithm detects multiple items (tin height, area, volume, offset, tin connection, etc., data visualization) programming and debugging is more convenient
Specifications
AIS-63X HW
Specification Details
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